Polishing process: Mirror finish on low hardness copper using lap processing.
Achieved a mirror finish on pure copper, which is difficult to process and handle!
We would like to introduce our achievements in achieving a mirror finish through lapping processing on low-hardness copper. Due to its low hardness and susceptibility to scratches, processing and handling pure copper can be challenging, but we have successfully achieved a mirror finish. Our double-sided grinding and lapping technology does not use magnets for workpiece fixation; instead, it polishes and grinds the workpiece by sandwiching it between upper and lower rotating grinding wheels, allowing us to accommodate various materials, including non-magnetic and difficult-to-machine materials. Please feel free to consult us when needed. 【Product Specifications】 ■ Material: Tough pitch copper (99.9% pure copper) ■ Processing Type: Lapping ■ Dimensions & Precision: φ30, Surface Roughness: Ra0.009μm, Rmax0.2μm ■ Industry: Semiconductor ■ Supported Lot Size: 200 pieces/month *For more details, please refer to the related links or feel free to contact us.
